modular speaker
2026, TEAK STUDIOS
This project consolidates my prior work in loudspeaker design, enclosure acoustics, and Digital Signal Processing into a production-ready 3D-printed speaker system. A one-piece enclosure with an internal open-cell lattice increases panel stiffness while preserving over 92% of internal air volume, enabling low-frequency extension to 43 Hz.
The speaker is available as a kit thats assembled with a single screwdriver in under 10 minutes with no glue or soldering. It uses onboard DSP for crossover, EQ, and driver protection, and supports stereo, mono, and daisy-chained configurations with optional ESP32-based wireless expansion.
*these are photographs, not renders*
